序号 标准号 标准名称 1 IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards印制板用经处理S玻璃纤维织物规范 2 IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards印制板用经处理聚芳酰胺纤维编织物规范 3 IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards 印制板用经处理石英（熔融纯氧化硅）纤维编织物规范 4 IPC-2524 PWB Fabrication Data Quality Rating System 印制板制造数据质量定级体系 5 IPC-9151A Printed Board Process Capability Quality and Relative Reliability Benchmark Test Standard and Database印制板工艺 容量 质量可靠性试验标准和数据库 6 IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) 实施统计过程控制(SPC)的通用导则 7 IPC-9199 Statistical Process Control (SPC) Quality Rating 统计分析控制 8 IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards 未组装印制板电测试要求和指南 9 IT-97061 PWB Hole to Land Misregistration: Causes and Reliability印制线路板通孔与焊盘的错位: 原因和可靠性 10 IT-98103 Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels 多层板内部无焊盘层互连错位的可靠性 11 IPC-MS-810 Guidelines for High Volume Microsection 大批量显微剖切导则 12 IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards Components &Materials 印制板、元器件及材料检验试验设备的认证 13 IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1 &2 International Round Robin Test薄层压板尺寸稳走性试----国际联合试验计划I阶段及II阶段报告 14 IPC-TR-486 Round Robin Study to Correlate IST &Microsectioning Evaluations for Inner-Layer Separation 内层分离的互连应力测试(IST)与显微剖切相关性联合研究 15 IPC-T-50F Terms and Definition for Interconnecting and Packaging Electronic Circuits电子电路互连与封装的定义和术语 16 IPC-S-100 Standards and Specifications Manual标准和详细说明汇编手册 17 IPC-E-500 IPC Electronic Document Collection已出版的IPC标准电子文档资料合订本 18 IPC-TM-650 Test Methods Manual试验方法手册 19 IPC-ESD-20-20 Association Standard for the Development of an ESD Control Program静电释放控制过程(由静电释放协会制定) 20 IPC/EIA J-STD-001C Requirements for Soldered Electrical &Electronic Assemblies电气与电子组装件锡焊要求 21 IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001—Includes Amendment 1J-STD-001辅助手册及指南及修改说明1 22 IPC-A-610C Acceptability of Electronic Assemblies印制板组装件验收条件 23 IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C ComparisonIPC-610手册和指南(包括IPC-A-610B和C的对比) 24 IPC-EA-100-K Electronic Assembly Reference Set电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。 25 IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies电缆和引线贴装的要求和验收 26 IPC/EIA J-STD-012 Implementation of Flip Chip and Chip Scale Technology倒装芯片及芯片级封装技术的应用 27 IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation芯片直装技术实施导则 28 IPC/EIA J-STD-026 Semiconductor Design Standard for Flip Chip Applications倒装芯片用半导体设计标准 29 J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size ConfigurationsFC（倒装片）和CSP(芯片级封装)的外形轮廓标准 30 IPC/EIA J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒装芯片及芯片级凸块结构的性能标准 31 SMC-WP-003 Chip Mounting Technology 芯片贴装技术 32 J-STD-013 Implementation of Ball Grid Array and Other High Density Technology球栅阵列 (BGA)及其它高密度封装技术的应用 33 IPC-7095 Design and Assembly Process Implementation for BGAs球栅阵列的设计与组装过程的实施 34 IPC/EIA J-STD-032 Performance Standard for Ball Grid Array BallsBGA球形凸点的标准规范 35 IT-98000 JPL Chip Scale Packaging GuidelinesJPL 发布的CSP导则注： 36 IT-98080 JPL Ball Grid Array Packaging GuidelinesJPL 发布的BGA封装导则 37 IT-98093 ITRI Chip Carrier Phase 1 ReportITRI 关于芯片载体的报告ITRI (The Interconnect Technology Research Institute) 38 IPC-MC-790 Guidelines for Multichip Module Technology Utilization多芯片组件技术应用导则 39 IPC-M-108 Cleaning Guides and Handbook Manual 清洗导则和手册 40 IPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us电路板离子洁净度测量：它告诉我们什么？ 41 IPC-CH-65A Guidelines for Cleaning of Printed Boards &Assemblies印制板及组装件清洗导则 42 IPC-SC-60A Post Solder Solvent Cleaning Handbook 锡焊后溶剂清洗手册 43 IPC-SA-61 Post Solder Semi-aqueous Cleaning Handbook 锡焊后半水溶剂清洗手册 44 IPC-AC-62A Aqueous Post Solder Cleaning Handbook 锡焊后水溶液清洗手册 45 IPC-TR-476A Electrochemical Migration: Electrically Induced Failures in Printed Circuit Assemblies 电化学迁移：印制电路组件的电气诱发故障 46 IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results清洗及清洁度试验计划1阶段试验结果 47 IPC-TR-582 Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids Fluxes and Pastes Processed in Ambient Air IPC第3阶段非清洗助焊剂研究 48 IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing 深入离子洁净度测试 49 IPC-9201 Surface Insulation Resistance Handbook 表面绝缘电阻手册 50 IPC-TP-104K Cleaning &Cleanliness Test Program Phase 3 Water Soluble FluxesPart 1 &Part 2第3阶段水溶性助焊剂清洗，第一和第二部分 51 IPC-M-109 Component Handling Manual 元件处理手册 52 IPC/JEDEC J-STD-020B Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices 非密封固态表面贴装器件湿度／再流焊敏感度分类 53 IPC/JEDEC J-STD-033A Handling Packing Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices 对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用 54 IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components 非气密封装电子元件用声波显微镜 55 IPC-9500-K Set of four documents 9501-9504 9501至9504手册合订本 56 IPC-DRM-18F Component Identification Desk Reference Manual 零件分类标识手册 57 IPC-DRM-SMT-C Surface Mount Solder Joint Evaluation Desk Reference Manual接插件焊接点评价手册 58 IPC-DRM-40E Through-Hole Solder Joint Evaluation Desk Reference Manual接插件焊接点评价手册 59 IPC-DRM-56 Wire Preparation &Crimping Desk Reference Manual导线和端子预成形参考手册 60 IPC-DRM-53 Introduction to Electronics Assembly Desk Reference Manual电子组装基础介绍手册 61 IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments表面安装焊接件加速可靠性试验导则 62 IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting以表面安装为主的元件封装及互连导则 63 IPC-TA-724 Technology Assessment Series on Clean Rooms 清洁室技术精选系列 64 IPC-TA-723 Technology Assessment Handbook on Surface Mounting表面安装技术精选手册 65 IPC-TA-722 Technology Assessment of Soldering 锡焊技术精选手册 66 IPC-M-104 Standards for Printed Board Assembly Manual 10种常用印制板组装标准合订本 67 IPC-M-103 Standards for Surface Mount Assemblies Manual 所有SMT标准合订本 68 IPC-PD-335 Electronic Packaging Handbook 电子封装手册 69 IPC-7525 Stencil Design Guidelines 网版设计导则 70 IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study IPC第3阶段受控气氛焊接研究 71 IPC/EIA J-STD-004 Requirements for Soldering Fluxes-Includes Amendment 1锡焊焊剂要求（包括修改单1） 72 IPC/EIA J-STD-005 Requirements for Soldering Pastes-Includes Amendment 1焊膏技术要求（包括修改单1） 73 IPC-HDBK-005 Guide to Solder Paste Assessment 焊膏性能评价手册 74 IPC/EIA J-STD-006A Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders 电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求 75 IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives表面安装用介电粘接剂通用要求 76 IPC-CA-821 General Requirements for Thermally Conductive Adhesives导热胶粘剂通用要求 77 IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives表面贴装导电胶使用指南 78 IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films各向异性导电胶膜的一般要求 79 IPC-CC-830B Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies 印制板组装电气绝缘性能和质量手册 80 IPC-HDBK-830 Guideline for Design Selection and Application of Conformal Coatings敷形涂层的设计，选择和应用手册 81 IPC-SM-840C Qualification and Performance of Permanent Solder Mask - Includes Amendment 1永久性阻焊剂的鉴定及性能(包括修改单1) 82 IPC-HDBK-840 Guide to Solder Paste Assessment 焊膏性能评价手册 83 IPC-TP-1114 The Layman’s Guide to Qualifying a Process to J-STD-001基于J-STD-001组装工艺雷氏选择法 84 IPC-TR-467 Supporting Data &Numerical Examples for J-STD-001 (Control of Fluxes) J-STD-001(焊剂控制)的支持数据及数字实例 85 IPC-AJ-820 Assembly &Joining Handbook 装联手册 86 IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow &Wave) Processes 大规模焊接(回流焊与波峰焊)过程温度曲线指南 87 IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 表面安装锡焊件性能试验方法与鉴定要求 88 IPC-TP-1090 The Layman’s Guide to Qualifying New Fluxes 新型助焊剂雷氏选择法 89 IPC-TP-1115 Selection and Implementation Strategy for a Low-Residue No-Clean Process 低残留不清洗工艺的选择和实施 90 IPC-S-816 SMT Process Guideline &Checklist 表面安装技术过程导则及检核表 91 IPC-TR-460A Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards印制板波峰焊故障排除检查表 92 IPC-CM-770D Component Mounting Guidelines for Printed Boards印制板元件安装导则 93 IPC-7912 Calculation of DPMO &Manufacturing Indices for Printed Board Assemblies印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算 94 IPC-9261 In-Process DPMO and Estimated Yield for PWAs 印制板组装过程中每百万件缺陷数(DPMO)及合格率估计 95 IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components 电子元件的印制板组装过程模拟评价 96 IPC-9502 PWB Assembly Soldering Process Guideline for Electronic Components电子元件的印制板组装焊接过导则 97 IPC-9503 Moisture Sensitivity Classification for Non-IC Components非集成电路元件的湿度敏感度分级 98 IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components) 非集成电路元件的组装过程模拟评价（非集成电路元件预处理） 99 IPC-9850-K Surface Mount Placement Equipment Characterization-KIT表面贴装设备性能检测方法的描述（附Gerber格式CD盘） 100 IPC-9850-TM-KW, IPC-9850-TM-K Test Materials Kit for Surface Mount Placement Equipment Standardization 表面贴装设备性能测试用的标准工具包•